Contributing to the Environment through Our Products

The semiconductor memories and solid-state drives (SSDs) that KIOXIA supplies are
integrated into a wide range of products and used throughout the world. We believe that we can contribute to the realization of a low carbon society by supplying large-capacity products and low-power-consumption products, and we are engaged in a number of initiatives to this end.

Amidst the recent acceleration in the use of AI and IoT, there is a growing need to increase the capacity and speed of flash memory and SSD products. By promoting increases in the capacity of flash memory through the development of integration technology, KIOXIA is working to reduce CO2  emissions per capacity both in manufacturing and use of flash memory and SSDs. Specifically, we contribute to the reduction of CO2  emissions by reducing the amount of electricity used per unit of capacity and materials used when manufacturing, and by lowering the power consumption of our products when in use.

We believe that KIOXIA flash memories and SSDs will play an important role in the area of 5G (the fifth-generation mobile communication system), which is expected to become more widespread in the future. Since faster, higher capacity devices are expected to be necessary in the 5G world, we envisage that the cutting-edge large-capacity flash memory and low-latency SSDs we provide will contribute to society in various fields. Thus, we are supporting the provision of increased capacity by developing advanced integration technology as our top priority.

Examples of fields that KIOXIA products contribute to

Examples of fields that KIOXIA products contribute to

Product Case Studies: UFS Ver. 3.1 Embedded Flash Memory Devices

KIOXIA has developed the UFS product, an embedded flash memory that complies with the JEDEC UFS [1] Version 3.1 interface.

UFS Ver. 3.1 embedded flash memory device (11.5 × 13 mm standard JEDEC package)

UFS Ver. 3.1 embedded flash memory device
(11.5 × 13 mm standard JEDEC package)

Next-generation mobile 5G devices will improve communication speeds and process a high volume of data communications; thus, embedded storage must be high- performance and more energy-efficient as well as consume less standby energy.
The UFS product is an embedded flash memory with a control function that integrates with our 3D flash memory BiCS FLASH™ and a controller chip. To meet the aforementioned requirements and diverse needs, it comes in three different storage sizes, namely 128 GB, 256 GB and 512 GB [2].

The UFS product incorporates the following major functions in order to achieve high performance, higher energy efficiency, and lower standby power consumption: WriteBooster*, Host Performance Booster (HPB) Ver. 1.0, and UFS-DeepSleep Power Mode*.

Thanks to the WriteBooster function, the UFS product's sequential write speed is approximately two to three times faster that of our previous product (Ver. 3.0), thereby contributing to reduced data transfer times and improved power efficiency.
The sequential read speed of the UFS product exceeds that of the previous product by approximately 30%.

As for random read performance, the UFS product supports Host Performance Booster (HPB) Ver. 1.0 (extended in Ver. 3.1) thus allowing better utilization of the host's memory and increasing the number of transfers per unit time. In addition, it supports UFS-DeepSleep Power Mode* to reduce standby energy consumption compared to our previous product. The UFS product can be utilized in 5G smartphones as well as in a wide range of devices, such as PCs and VR/AR equipment.

*New features of JEDEC UFS Version 3.1

[1] UFS (Universal Flash Storage): A standard for embedded flash storage stipulated by JEDEC. Because it uses a duplex serial interface, reading and writing can be performed simultaneously between the storage unit and the host device.

[2] The description of this product is based on the amount of built-in flash memory, not on the amount of memory available for use. As a portion of the memory is used as a management area, please refer to the relevant specifications for details of the available memory space (user area).

Product Case Studies: Fifth-generation 3D flash memory BiCS FLASH™

KIOXIA has developed the fifth generation of our 3D flash memory BiCS FLASH™ by applying a 112-layer process.  This product is a 512-gigabit (64-gigabyte) 3-bit-per-cell (TLC). We have optimized the circuit techniques and processes in order to minimize the chip size, thereby increasing the memory capacity per unit of area by approximately 20% compared to the fourth generation 96-layer BiCS FLASH™. This makes it possible to increase the memory capacity per silicon wafer, thereby reducing the amount of resources used and cost per capacity unit. In addition, this product has 50% better interface performance and achieves improved program and read performance, thereby realizing approximately 20% better energy efficiency per data transfer unit.

112-layer fifth-generation 3D flash memory BiCS FLASH™

112-layer fifth-generation 3D flash memory BiCS FLASH™

KIOXIA will respond to the ever-growing demand for SSDs for datacenters, enterprise SSDs, SSDs for PCs, and products for smartphones, as well as the new demand that will be created by 5G networks, AI, and self-driving systems.

Note: The above company names, product names and service names may be trademarks of their respective companies.

Product Case Studies: KIOXIA CM6 series: PCIe®4.0 and NVMe™1.4-compliant enterprise SSD

As companies accelerate their digital transformations, larger and faster storage that supports data processing and analysis has become increasingly important.

The enterprise KIOXIA CM6 series is a lineup of fourth-generation 96-layer three-dimensional flash memory SSDs that support PCIe®4.0 and NVMe™1.4.

These SSDs achieve a maximum sequential read speed of 6.9 GB/s, enterprise SSDs deliver best-in-class [1] and more than twice as fast as the maximum sequential read speed of our previous KIOXIA CM5 series.

Because PCIe®4.0 support can enhance performance, but only in exchange for a higher temperature inside the SSD, we have improved the shapes of the thermal interface materials compared to our previous product, thereby achieving better performance.

KIOXIA CM6 series: Enterprise SSD with improved power efficiency

KIOXIA CM6 series:
Enterprise SSD with improved power efficiency

The KIOXIA CM6 series boasts superior throughput per unit of electric power and improved power efficiency.

The bottom graphs show the measured values per unit watt [2]. The KIOXIA CM6 series is more power-efficient than the previous product in almost all areas. In particular, for 4 KB random read performance, the KIOXIA CM6 series is approximately 37% more power-efficient than the previous product.

In tests that measure performance by simulating the read-write ratios of online transaction processing, online analytical processing, file server, and webserver (which perform to common data read and write ratios), the KIOXIA CM6 series achieves 25–35% better performance per watt, as shown in the graph; thus, it can process more data while consuming less power.

In addition to the improved power efficiency, the KIOXIA CM6 series includes models with capacities of up to 30.72 TB [3]. The larger capacity and smaller footprint significantly contribute to reducing the number of servers and total cost of ownership.

Comparison of Power Efficiency

Comparison of Power Efficiency

[1] As of February 21, 2020, in the category of enterprise SSDs: KIOXIA Corporation survey.
[2] As of June 2020.  Measured CM5 (Read-Intensive, 3.84TB) and CM6 (Read-Intensive, 3.84TB) under KIOXIA’s test environment (using FIO, part of which simulates an enterprise environment).
[3] Definition of capacity: KIOXIA defines a gigabyte (1 GB) as 1,000,000,000 (10 to the power of 9) bytes, and a terabyte (1 TB) as 1,000 gigabytes (GB). Some computer operating systems, however, report storage capacity using powers of 2 under a definition   of 1 GB = 1,073,741,824 (two to the power of 30) bytes; therefore, they show a lower storage capacity figure for the same actual amount of storage. The available storage capacity varies based on file size, disk formatting, settings, software, the operating system, and other factors. Actual formatted capacity may vary.

* PCIe  is a registered trademark of PCI-SIG.

* NVMe is a trademark of NVM Express, Inc.

* The above company names, product names and service names may be trademarks of their respective companies.